Electronic Ceramics for Thermoelectric Peltier Coolers
Z-MAX offers premium alumina and direct bonding copper (DBC) ceramic substrates designed for thermoelectric devices, ensuring efficient heat dissipation and high mechanical and electrical performance. These ceramics are ideal for power electronics, semiconductor refrigeration, and integrated cooling solutions.
Unique Features
| Property | Alumina Ceramic Substrate |
|---|---|
| Color | White |
| Density | 3.70 g/cm³ |
| Material Purity | ≥96% Alumina |
| Water Absorption | 0.0% |
| Compressive Strength | ≥294 MPa |
| Coefficient of Thermal Expansion | 6.8–7.8 ×10⁻⁶/°C |
| Thermal Conductivity | ≥20 W/m·K |
| Volume Resistivity | 10¹⁴ Ω·cm |
| Dielectric Constant (25°C, 1 MHz) | 9.5–10.2 |
| Dielectric Loss Angle Tangent | 3×10⁻⁴ |
| Dielectric Breakdown Strength | ≥20 KV/mm |
| Surface Roughness | 0.3–0.5 μm |
Customized shapes and metallized or plated copper electrode ceramics (DBC types) are available to meet specific application requirements.